PCB Designer

Long Finch Technologies

Waukesha, WI

Posted On: Mar 14, 2024

Posted On: Mar 14, 2024

Job Overview

Job Type

Contract - Corp-to-Corp, Contract - W2, Contract - Independent, Contract to Hire - Corp-to-Corp, Contract to Hire - Independent, Contract to Hire - W2

Experience

4 - 10 Years

Salary

Depends on Experience

Work Arrangement

On-Site

Travel Requirement

0%

Required Skills

  • PCB Design
  • Cad Design
  • Circuit Designer
  • eCAD designers
  • Packaging circuit boards
Job Description

Job Description:

  • Packaging circuit boards into mechanical enclosures and assemblies leveraging Cadence Design tools and IPC standards.
  • Guide engineers in component selection, placement, stack-up and material cost, routing, in-circuit test point location, artwork generation, assembly drawing creation, manufacturing documentation, archival and configuration control
  • Work with global suppliers and create design outputs with a global team
  • Review external supplier layout designs to ensure high quality, as needed
  • Institutionalize operating mechanisms that ensure standardization of work across multiple teams
  • Utilizing independent judgement, construct, evaluate and improve complex engineering problem statements and promote creative solutions to improve engineering efficiency and outcomes.
  • Take ownership for business objectives including delivery, EHS, productivity, cost management, serviceability, quality.
  • Little to no direction is given in execution of job-related activities.
  • Comply with EHS regulations and policies.
  • Experience with Valor design checks
  • Associates degree or equivalent in electronics technology
  • Minimum of 4 years’ experience with complex analog, power, high speed digital, or RF PWB designs
  • Demonstrated teamwork, coordination, and communication skills both locally and globally
  • Demonstrated IPC PWB design principles knowledge
  • Demonstrated ability to lead and supervise a team of eCAD designers or external vendors.
  • Demonstrated experience with circuit stack-ups and routing with 2 to 14+ layers
  • Experience with Cadence CAD capture and design tools
  • Demonstrated experience with micro-vias, very fine pitch devices, and high-density processors/FPGAs (>1000 contact BGAs)
  • Demonstrated experience with signal integrity constraints management

Job ID: LF240081


Posted By

Andy

HR Manager