Roles and Responsibilities

• Design and develop complex PCBs using industry-standard CAD tools, with a strong preference for Cadence Allegro
• Create and manage PCB layouts for high-speed interfaces such as Ethernet (2.5G/5G/10G), PCIe, DDR, and high-speed memory
• Develop stack-ups and manage design constraints to meet signal integrity, power integrity, and manufacturing requirements
• Apply DFM and DFT principles to ensure manufacturability and testability
• Design PCBs with low-pitch, high-density BGAs and SMD/BGA connectors
• Address thermal, mechanical, EMI, and EMC constraints, particularly for airborne or ruggedized environments
• Collaborate with electronics, mechanical, and systems engineering teams throughout the design lifecycle
• Prepare and maintain Product Data Packages (PDP), including BOMs, documentation, and related design files
• Support PCB fabrication and assembly by resolving layout, manufacturing, and test issues

Required Qualifications

• Advanced training in electronics with 5+ years of experience in an electronic design environment.
• Strong expertise in electronic CAD tools and PCB layout, Cadence Allegro proficiency required.
• In-depth knowledge of PCB materials, fabrication technologies, and component packaging.
• Strong understanding of high-speed signal and power design concepts, including impedance control, length matching, and shielding
• Experience with stack-up design and constraint management tools.
• Awareness of thermal, mechanical, and EMC considerations in PCB and PCBA design

Preferred Qualifications

• Experience in Signal Integrity (SI) and Power Integrity (PI) simulation
• Experience designing for airborne or rugged environments
• Ability to work as an individual contributor, owning tasks end-to-end with minimal supervision.

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